A report from Korea is suggesting that Apple may be planning to use “fan-out” packaging technology for the iPhone 7, according to AppleInsider. This technology would allow Apple to use the space inside the iPhone 7 carriage to it’s maximum capacity.
The iPhone 7’s antenna switching module and radio frequency chip would directly affected by this technology according to ETnews, which is where AppleInsider credits sourcing their information. The technology would allow these two components to shrink the I/O terminal density, which in turn means smaller chip sizes.
Considering that most other iPhone 7 rumors point to Apple keeping the general design on the iPhone 6s for the iPhone 7, with some minor changes including the removal of the back antennas, removing the bevels around the screen and making the camera flat with the carriage instead sticking out, this fan-out packaging technology may be one of the ways Apple is planning to differentiate the iPhone 7 from its generational predecessor.
If Apple’s previous release schedule is any indication, expect the iPhone 7 to be released this September. The size of the iPhone 7 will probably remain the same size as the iPhone 6s, especially considering the recent release of the iPhone SE, which is a 4-inch iPhone compared to the 4.7-inches of the iPhone 6s and 5.5-inches of the iPhone 6s Plus.
