The iPhone 7 Pro — Apple seems to be porting over its MacBook line naming convention — will not have a headphone jack, nor will it be any slimmer than the current iPhone 6s Plus, according to Mac Fan, an Apple-centric magazine based in Japan. Reportedly, Mac Fan has managed to get hold of detailed design schematics for the iPhone 7 Pro.
These design schematics state that the iPhone 7 Pro, or the 5.5-inch iPhone model formerly known as Plus, will be as thick as the iPhone 6s Plus: 7.3 mm. For reference, the iPhone 6 Plus was 7.1 mm thick but the added 3D Touch module Apple included with “s” sub-generational jump boosted the size of the device.
The leaked design schematics also suggest that the dual rear-facing camera rumor may have sea legs. Infamously accurate KGI Securities analyst Ming-Chi Kuo has already gone on record to his firm’s investors as saying he believes Apple will implement the technology in the next iPhone generation, and a leaked photo of the iPhone 7 rear carriage included an extra large cut-out where the camera goes.
While you do have to pay for a PDF version of Mac Fan, 9to5Mac is hosting a non-translated screenshot of the schematics.
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Bonus pug meme:
